System Overview

The excimer laser lift-off system uses an excimer laser as the light source, which is homogenized and shaped to produce a highly uniform, high-energy-density line-shaped laser beam. It is suitable for lifting off thin films such as polyimide from substrates like glass and sapphire, with a high lift-off yield. The excimer laser output is in the ultraviolet band, resulting in a small absorption depth in the sample and minimal damage to flexible substrates. The excimer laser lift-off system is primarily used in the production and R&D of flexible displays and flexible electronics.

System Features

• Suitable for lifting off thin films such as polyimide from substrates like glass and sapphire  
• Line-scan beam enables uniform lift-off of large-area samples
• Multi-lens array homogenization technology ensures excellent beam uniformity
• Laser wavelength selectable at 308nm or 248nm

Technical Specifications