Excimer laser annealing system

System Overview The excimer laser annealing system uses an excimer laser as the light source, and after beam homogenization and shaping, it obtains an extremely uniform high-energy-density line-shaped laser beam, enabling uniform scanning of large-area samples; The excimer laser annealing system outputs a short wavelength with high photon energy and small sample absorption depth, primarily used for annealing or modification research of thin film materials, such as low-temperature polycrystalline silicon thin film annealing and development of optoelectronic functional thin film materials.

Excimer laser ablation system

System Overview Laser ablation is an important technique for micro-area analysis and a key development direction for in-situ micro-area trace element and isotope analysis. The LA-193 excimer laser ablation system offers exceptional cost-effectiveness, with the laser fully localized in domestic production, and its software and hardware support direct coupling with inductively coupled plasma mass spectrometers and spectrometers. The 193nm excimer laser is a "cold laser" in the deep ultraviolet band, and its high-energy-density uniform flat-top laser can ablate various samples, including transparent materials such as high-purity quartz and fluorite.

Excimer laser lift-off system

System Overview The excimer laser lift-off system uses an excimer laser as the light source, which, after beam homogenization and shaping, produces an extremely uniform high-energy-density line-shaped laser beam, suitable for lifting off films such as polyimide from substrates like glass and sapphire, with a high lift-off yield; The excimer laser output is in the ultraviolet band, with a small absorption depth in the sample, causing minimal damage to the flexible substrate; The excimer lift-off system is mainly used for the production and research and development of flexible displays and flexible electronics.

EPM excimer laser micro-marking system