Excimer laser systems and equipment

Excimer laser annealing system

System Overview The excimer laser annealing system uses an excimer laser as the light source, and after beam homogenization and shaping, it obtains an extremely uniform high-energy-density line-shaped laser beam, enabling uniform scanning of large-area samples; The excimer laser annealing system outputs a short wavelength with high photon energy and small sample absorption depth, primarily used for annealing or modification research of thin film materials, such as low-temperature polycrystalline silicon thin film annealing and development of optoelectronic functional thin film materials.

Excimer laser annealing system

Product Features

System Features

  • Line-scanning beam enables uniform processing of large-area samples
  • Multi-level lens array homogenization technology ensures excellent beam uniformity
  • Laser wavelengths selectable at 308nm, 248nm, with 351nm and 193nm available upon customization
  • Line beam dimensions customizable 

Hardware specifications


Model

ELA-308-100

ELA-248-100

ELA-248-50

Laser Wavelength

308nm

248nm

248nm

Laser Beam Size

100mm×0.3mm

100mm×0.4mm

50mm×0.8mm

Maximum Laser Energy Density

450 mJ/cm2

200 mJ/cm2

200 mJ/cm2

Beam Uniformity

>92%

>92%

>92%

Scan Step Accuracy

5μm

5μm

5μm

Processing Atmosphere

N2/Air

N2/Air

N2/Air

Weight

500Kg

500Kg

500Kg

Cooling Method

Air

Air

Air

Dimensions (L×W×H)

1600mm×1600mm×1400mm

1800mm×900mm×1600mm

1800mm×900mm×1600mm

Optional information

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