Excimer laser systems and equipment

Excimer laser lift-off system

System Overview The excimer laser lift-off system uses an excimer laser as the light source, which, after beam homogenization and shaping, produces an extremely uniform high-energy-density line-shaped laser beam, suitable for lifting off films such as polyimide from substrates like glass and sapphire, with a high lift-off yield; The excimer laser output is in the ultraviolet band, with a small absorption depth in the sample, causing minimal damage to the flexible substrate; The excimer lift-off system is mainly used for the production and research and development of flexible displays and flexible electronics.

Excimer laser lift-off system

Product Features

System Features

  • Suitable for peeling thin films such as polyimide from substrates like glass and sapphire  
  • Line-scanning beam enables uniform peeling of large-area samples
  • Utilizes multi-level lens array beam homogenization technology for excellent beam uniformity
  • Laser wavelengths selectable at 308nm and 248nm

Hardware specifications

Technical Parameters 

Model

LLO-308-100

LLO-248-100

Laser Wavelength

308nm

248nm

Laser Beam Size

100mm×0.3mm

100mm×0.4mm

Maximum Laser Energy Density

300 mJ/cm2

200 mJ/cm2

Beam Uniformity

>92%

>92%

Scanning Step Accuracy

5μm

5μm

Weight

500Kg

500Kg

Cooling Method

Water

Water

Dimensions (L×W×H)

1600mm×1600mm×1400mm

1800mm×900mm×1600mm

Optional information

Become a first-class one-stop solution service provider for excimer lasers and excimer laser systems

在线客服
在线
对方正在输入...
您有任何问题可以咨询我们